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Adsorption stage - List of Manufacturers, Suppliers, Companies and Products

Adsorption stage Product List

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Porous adsorption stage

Porous adsorption stage

Porous adsorption stage

Reduce defect rates due to pickup errors Porous adsorption stage 【Features】 ○ Reduces pickup errors caused by chip floating and rotation ○ Capable of full surface adsorption of wafer sheets ○ Eliminates warping of wafer sheets ○ Stabilizes needle lift amount ○ Improves operational efficiency ○ Prevents foreign matter contamination due to plating peeling ○ Custom orders available for various materials and shapes ● For other functions and details, please download the catalog.

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Porous adsorption stage

Porous adsorption stage

Introducing products related to semiconductor manufacturing, including "vacuum chucks" and "heat comas"!

We would like to introduce our "Porous Adsorption Stage." The "Vacuum Chuck" is used to hold wafers during die bonding. Additionally, to solve issues such as neighboring chip lift-off or rotation during pickup, we recommend the "Porous Chuck." Furthermore, the "Heat Coma" allows for uniform adsorption across the entire surface without the need for adsorption holes by using porous materials in the work mounting area. 【Features】 <Vacuum Chuck> ■ Holds wafers during die bonding ■ Custom orders can accommodate various materials, shapes, and patterns <Porous Chuck> ■ Capable of uniformly holding wafer sheets (chips) across the entire surface ■ Eliminates warping of wafer sheets *For more details, please refer to the related links or feel free to contact us.

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